MFF2 form factor
A solderable chip that survives industrial temperatures, vibration and a 10+ year product life.
The SIM, soldered in.
An MFF2 embedded eSIM rated for heat, shock and vibration, with profiles provisioned and updated remotely. No tray, no swap, no field visits.
SIM form factors
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What you get
01 02 03
Made for hardware that lasts.
Remote provisioning
Load and change operator profiles over the air, long after the device is sealed and shipped.
Tamper resistant
The profile lives in a secure element, locked to the device and resistant to extraction.
850+carriers reachable
190+countries
99.9%platform uptime
How it works
Provisioned once it powers on.
Ship hardware with a blank or bootstrap profile and assign the real one remotely when it connects. Change carriers later without touching the device.
- Industrial MFF2 (heat, shock, vibration)
- Over-the-air profile management
- GSMA remote provisioning
- Locked to the secure element
// push a profile to an embedded eSIM
esim.provision({
eid: "8900...41",
profile: "global-iot"
});
esim.provision({
eid: "8900...41",
profile: "global-iot"
});
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